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Recommended Soldering Method
■ Temperature Profile According to IRS
When performing reflow-soldering, check the profile on an actual
device after setting the temperature condition so that the tempera-
tures at the relay terminals and the upper surface of the case do not
The thickness of cream solder to be applied should be within a range
between 150 and 200 μ m on OMRON's recommended PCB pattern.
exceed the limits specified in the following tables.
Correct Soldering
Incorrect Soldering
T4
T3
PCB
Relay
Terminal
Solder
Land
Insufficient
amount of
solder
Excessive
amount of
solder
T2
T1
t 1
Preheating
t 2
Soldering
Visually check that the Relay is properly soldered.
Time (s)
Mounting Solder: Lead Based
Item
Preheating
Soldering
Peak value
Measuring
position
(T1 to T2, t 1 )
(T3, t 2 )
(T4)
Terminal
150 ° C to 180 ° C, 180 ° C to 200 ° C, 245 ° C max.
120 s max.
20 to 30 s
Upper surface ——
of case
Mounting Solder: Lead-free
Item
Preheating
——
Soldering
250 ° C max.
Peak value
Measuring
position
(T1 to T2, t 1 )
(T3, t 2 )
(T4)
Terminal
150 ° C to 180 ° C, 230 ° C,
120 s max.
30 s max.
250 ° C max.
Upper surface ——
of case
——
255 ° C max.
■ Approved Standards
UL Recognized (File No. E41515) / CSA Certified (File No. LR31928) - - Ambient Temp. = 40 ° C
Contact form
SPST-NO
Coil rating
G6L-1P and G6L-1F: 3 to 24 VDC
Contact rating
1A at 30 VDC (Resistive)
Number of test operations
6,000
0.5A at 60 VDC (Resistive)
0.3A at 125 VAC (General Use)
Low Signal Relay
G6L
37
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相关代理商/技术参数
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